Reflectance spectroscopic film thickness monitors that uses optical interferometry.
These are easy to handle and can measure the thickness of transparent films from 1 nm to several hundred microns.
Compact film thickness monitor is a small and highly accurate reflective spectroscopic film thickness meter that uses a reflective probe with excellent optical properties.
It can also be used as an in-line monitor during the process or as an endpoint detection sensor.
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Wafer mapping film thickness measurement unit enables automatic mapping of the entire surface of 300mm wafer.
It is equipped with a highly accurate notch (or orientation flat) detection function and is used in combination with a compact film thickness monitor.
It can be installed at the load port of semiconductor manufacturing equipment to control the film thickness on the manufacturing equipment while maintaining cleanliness.
It can also be used to measure inside arbitrary patterns other than wafers.
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High resolution visualization of film thickness distribution by micro-imaging spectroscopy.
It can measure the film thickness distribution of transparent multilayer films in the microscope field of view with a high spatial resolution of 10 μm or less.
The reflectance spectroscopy method using optical interferometry can easily achieve film thickness accuracy of 0.1 nm or less.
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Measurement of the thickness of translucent sheets, low-reflection films, silicon, etc., which is difficult to measure with reflection spectroscopic film thickness monitor using optical interferometry
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