Specification
Item | Specification | ||||||||||||
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Installation type | Stand-alone | ||||||||||||
Target substarte | 100 mm, 125 mm, 150 mm, 200 mm, 300 mm Wafer with film | ||||||||||||
Light source | Selectable below 3 kinds ・ Deuterium Halogen lamp ・ Halogen lamp ・ White color LED |
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Meaurement distance | Max 60 mm | ||||||||||||
Beam spot | About 3 mmø (Option 1 mmø, but in case, it enables to do alignment) | ||||||||||||
Film thickness range | 10 nm - 50 nm | ||||||||||||
Max film layer | Max 9 layers | ||||||||||||
Repeatability | ≦ 0.1 nm | ||||||||||||
Analysis | Curve fitting method FFT method Peak detection method |
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Measurement time | ≦1 sec/point | ||||||||||||
Data transfer | USB 2.0 Cable ・ For data input ・ For Stage control |
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Power |
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Weight |
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Measurement |
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Automatic stage spec |
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Monitor display | Display film thickness on real time basis Mapping measurement result on graph display Statistic calculation result display |